Process for forming contact holes in contact regions of components integrated in a substrate comprises applying an insulating layer on a substrate with the integrated components, and applying a mask with openings

摘要

Process for forming contact holes in a number of contact regions of components integrated in a substrate comprises applying an insulating layer onto a substrate (5) with the integrated components; and applying a mask (M) with openings (01, 02, 03) on the sites on which contact holes are to be formed. The contact holes defined by the openings of the mask are etched using a mask. Preferred Features: Etching of part of the contact holes is carried out in two partial etching steps. In the first etching step, the insulating layer is etched up to an insulating layer covering the contact regions. In the second etching step, the insulating layer is removed to expose the contact regions so that the contact holes penetrate the contact holes and the insulating layer and extend up to contact regions located below the insulating layer.