Apparatus and method for determining the orientation of a crystallographic plane relative to the crystal surface and apparatus and method for the separation of a single crystal in a cutting-off machine

摘要

The invention relates to a device and a method for determining the orientation of a crystallographic plane (100) in relation to a crystal surface (2). Said method permits an orientation, in which adhesive defects of the crystal or contamination of the fixing elements for the crystal are eliminated. To achieve this, the angle, which is formed by the crystal surface to be measured and a reference axis and the angle, which is formed by the crystallographic plane and the reference axis, are measured and a differential is calculated. The required correction is subsequently made in a wire-saw device comprising an X-Y positioning unit, by means of the measurement of the orientation and the horizontal and vertical positions of the crystal are adjusted. This ensures that an additional degree of rotational freedom remains for the crystal on the cutting plane, to achieve a cut devoid of forces perpendicular to the feed direction and wire direction, so that the tools are not deflected and the cutting forces are minimal. The orientation accuracy is also increased.