Production of a semiconductor component e.g. transistor comprises forming recesses in a wafer from the rear side below active regions. processing the regions of wafer exposed on base of the recesses, and cutting the wafers above the lattice

摘要

Production of semiconductor component comprises: preparing wafer having active regions for semiconductor components; forming recesses in the wafer from the wafer rear side below the active regions so that supporting lattice of wafer material remains between recesses; processing regions of the wafer exposed on base of the recesses; and cutting wafers above lattice to form semiconductor components. Production of a semiconductor component comprises: preparing a wafer with a front side (101) and a rear side (102), in which a number of active regions (20) for semiconductor components are provided; forming recesses (112) in the wafer from the rear side below the active regions so that supporting lattice (110) of wafer material remains between the recesses; processing the regions of the wafer exposed on the base (103) of the recesses; and cutting the wafers above the lattice to form number of semiconductor components. Preferred Features: The recesses are produced by etching. The wafers have crevice regions between the active regions. The crevice regions are removed on cutting the wafers.