Automatic inspection method for the edge of a semiconductor wafer, using a video camera, by rotation of the wafer within the field of view of the camera and analysis of the recorded images according to preset sensitivity levels

摘要

Method wherein the wafer (1) to be inspected is placed and centered on a support (2) so that it can be rotated around a rotation axis (=T). The edge (3) of the wafer falls within the viewing field of a video camera (5) that has a connection image processing device (10) that automatically processes the recorded images to detect cracks, breaks or craters according to preset limits. The results are displayed, labeled and recorded. An Independent claim is made for a device for automatic inspection of a semiconductor wafer.