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Electronic component used in MOSFETs comprises a plate-like support element having a contact zone and a semiconductor body applied on the contact zone of the support element
Electronic component used in MOSFETs comprises a plate-like support element having a contact zone and a semiconductor body applied on the contact zone of the support element
Electronic component comprises a plate-like support element (2) having a contact zone and a semiconductor body (4) applied on the contact zone of the support element. The support element has a structure having alternating protrusions (22) and recesses (21) in the region of the contact zone. An Independent claim is also included for a process for the production of the electronic component. Preferred Features: The support element has strip-like protrusions in the region of the contact zone. The protrusions are surrounded by ring-like recesses. The semiconductor body is connected to the support element by a connecting layer, preferably made from gold, a gold compound, silver, a silver compound, tin, a tin compound, copper or a copper compound.
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