Process for conditioning the target surface during sputtering of a substrate comprises separately heating the target surface before sputtering to thermally condition the target surface

摘要

Process for conditioning the target surface (4) during sputtering of a substrate (6) comprises separately heating the target surface before sputtering to thermally condition the target surface so that a thermal effect on the conditioning of the target surface is prevented by heating the substrate during the sputtering process. An Independent claim is also included for a sputtering device for producing coated substrates comprising a cathode (2) having a target (3), a substrate with a substrate heater (7), and an anode (5). Preferred Features: The target surface is held at the same temperature level during the whole sputtering process.