Method for non-destructive detection of cracks in silicon wafers and solar cells involves placement of the test item between a light source and an electronic camera so that light transmitted through any cracks can be detected

摘要

Method for non-destructive and non-contact localization of cracks in silicon solar cells and silicon wafers uses an electronic camera to measure light transmitted through a wafer or cell. The light originates from a light source placed on the other side of the wafer or cell to the camera. The invention also relates to a corresponding device.