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Production of a metal-ceramic composite material used as substrate for electrical or electronic circuits comprises ceramic substrate and metal foil to a protective gas atmosphere during the joining process in a reaction chamber
Production of a metal-ceramic composite material used as substrate for electrical or electronic circuits comprises ceramic substrate and metal foil to a protective gas atmosphere during the joining process in a reaction chamber
Production of a metal-ceramic composite material comprises subjecting a ceramic substrate and a metal foil to a protective gas atmosphere during the joining process in a reaction chamber (8) formed by a capsule (1). Preferred Features: The reaction chamber is sealed from the outside. The reaction chamber is in contact with the protective gas atmosphere surrounding the capsule via an opening cross-section. The capsule has openings (7). The protective gas atmosphere contains 50-200, preferably 1-20 ppm oxygen during encapsulation of 80-95%. The ceramic substrate is made from Al2O3, Si3N4, SiC, forsterite and/or mullite.
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