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Production of an electronic unit comprises applying a conductor strip system as low melting system on a thin low sinterable flexible ceramic foil, sintering, applying a thin connecting material layer, and further processing
Production of an electronic unit comprises applying a conductor strip system as low melting system on a thin low sinterable flexible ceramic foil, sintering, applying a thin connecting material layer, and further processing
Production of electronic unit comprises: applying conductor strip system as low melting system on a thin low sinterable flexible ceramic foil; sintering; applying thin connecting material layer on the foil; placing the foil over the connecting material layer on the support; subjecting the unit to a low temperature; and applying and electrically connecting power elements to conductor strip system. Production of an electronic unit comprises: applying a conductor strip system as low melting system on a thin low sinterable flexible ceramic foil (5); sintering; applying a thin connecting material layer on the side of the sintered foil to be applied to the support (1); placing the sintered ceramic foil over the connecting material layer on the support; subjecting the unit of support and ceramic foil to a low temperature; and applying and electrically connecting power elements (7, 8) to the conductor strip system. Preferred Features: The flexible ceramic foil is a low temperature co-fired ceramic foil. The ceramic foil has a thickness of more than 0.1 mm. Sintering is carried out at 850-900 deg C. The connecting material layer is a layer containing glass.
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