首页> 外国专利> Production of an electronic unit comprises applying a conductor strip system as low melting system on a thin low sinterable flexible ceramic foil, sintering, applying a thin connecting material layer, and further processing

Production of an electronic unit comprises applying a conductor strip system as low melting system on a thin low sinterable flexible ceramic foil, sintering, applying a thin connecting material layer, and further processing

机译:电子单元的生产包括将导体带系统作为低熔点系统施加到薄的低可烧结柔性陶瓷箔上,进行烧结,施加薄的连接材料层并进行进一步处理

摘要

Production of electronic unit comprises: applying conductor strip system as low melting system on a thin low sinterable flexible ceramic foil; sintering; applying thin connecting material layer on the foil; placing the foil over the connecting material layer on the support; subjecting the unit to a low temperature; and applying and electrically connecting power elements to conductor strip system. Production of an electronic unit comprises: applying a conductor strip system as low melting system on a thin low sinterable flexible ceramic foil (5); sintering; applying a thin connecting material layer on the side of the sintered foil to be applied to the support (1); placing the sintered ceramic foil over the connecting material layer on the support; subjecting the unit of support and ceramic foil to a low temperature; and applying and electrically connecting power elements (7, 8) to the conductor strip system. Preferred Features: The flexible ceramic foil is a low temperature co-fired ceramic foil. The ceramic foil has a thickness of more than 0.1 mm. Sintering is carried out at 850-900 deg C. The connecting material layer is a layer containing glass.
机译:电子单元的生产包括:将导体带系统作为低熔点系统应用在薄的低烧结性柔性陶瓷箔上;烧结;在箔上涂薄薄的连接材料层;将箔片放在支撑物上的连接材料层上;使本机经受低温处理;将功率元件施加并电连接到导体带系统。电子单元的生产包括:将导体带系统作为低熔点系统施加在薄的低可烧结柔性陶瓷箔上(5);烧结;在烧结箔的要施加到支撑体(1)的一侧上施加薄的连接材料层;将烧结的陶瓷箔放置在支撑体上的连接材料层上;使载体和陶瓷箔的单元经受低温;将功率元件(7、8)施加并电连接到导体带系统。优选特征:柔性陶瓷箔是低温共烧陶瓷箔。陶瓷箔的厚度大于0.1mm。烧结在850-900℃下进行。连接材料层是包含玻璃的层。

著录项

  • 公开/公告号DE10148751A1

    专利类型

  • 公开/公告日2003-04-17

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE2001148751

  • 发明设计人 MATTMANN ERICH;

    申请日2001-10-02

  • 分类号H05K3/00;H05K7/20;H05K3/32;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:34

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号