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Targetted passivation of conductive track intermediate space or track regions on circuit board by applying conductive adhesive in region of tracks formed

机译:通过在形成的走线区域中施加导电粘合剂,对电路板上的走线中间空间或走线区域进行目标钝化

摘要

The method involves applying a passivation substance (2) to the intermediate spaces between conductive tracks, and then applying a conductive adhesive (3) in the region of the conductive tracks formed. The application of passivation substance involves the application of a passivation mask. An Independent claim is also included for a dispenser device for targetted passivation.
机译:该方法包括将钝化物质(2)施加到导电迹线之间的中间空间,然后在所形成的导电迹线的区域中施加导电粘合剂(3)。钝化物质的施加涉及钝化掩模的施加。还包括针对目标钝化的分配器设备的独立权利要求。

著录项

  • 公开/公告号DE10206442A1

    专利类型

  • 公开/公告日2002-11-14

    原文格式PDF

  • 申请/专利权人 ISA CONDUCTIVE MICROSYSTEMS GMBH;

    申请/专利号DE2002106442

  • 发明设计人 MEINEN TOMAS;

    申请日2002-02-15

  • 分类号H05K3/10;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:14

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