Process for electrolytically metallizing the walls of holes in e.g. circuit boards, conductor foils and strips comprises inserting the material into a working container, contacting with an electrolyte, and further processing

摘要

Process for electrolytically metallizing walls of holes in circuit boards, conductor foils and strips involves inserting the material into working container, contacting with electrolyte, forming electrolytic cell, galvanizing first side of material including all holes, changing anode/cathode distance in cell, changing poles of current source and electrochemically etching first side of material. Process for electrolytically metallizing the walls of holes in circuit boards, conductor foils and strips and for metallizing structures on the surface of materials in immersion bath devices, continuously operating devices and strip devices comprises: inserting the material into a working container; contacting the material with an electrolyte; conveying the electrolyte through the container and an electrolyte conditioning device; forming an electrolytic cell from an electrode and the material; connecting a current source electrically connected to a pole of the electrode and a pole of the first side of the material; galvanizing the first side of the material including all holes; changing the anode/cathode distance in the cell; changing the poles of the current source; electrochemically etching the first side of the material; and repeating the steps from the formation of the electrolytic cell. An Independent claim is also included for a device for carrying out the process. Preferred Features: During treatment of the second side of the material and through-contacting the holes, a second electrode is arranged opposite the second side of the material with a second current source. Soluble or inert anodes are used in the process.