Tempering device for electronic assembly e.g. for test purposes, comprises two gas supplies with by-pass lines in thermal contact with the supply lines to ensure they remain at essentially the same temperature as the tempering gas

摘要

The device comprises at least a gas supply line (4a, 4b) for delivery of a gas flow (2a, 2b) to the object (1) to be tempered and at least a by-pass line (5a, 5b) that is in thermal contact with the gas supply line and through which gas flows when the supply line is shut-off. The pipeline arrangement ensures that the supply lines remain approximately at the same temperature as the gas supply even when gas is not flowing through them. An Independent claim is included for a tempering method in which two gas flows are delivered to the object to be tempered with different temperatures.