Weak-magnetic field sensor used in e.g. automobiles and mobile phones, comprises first base board with first driving patterns, pair of first stacked boards with magnetic layers and pair of second stacked boards with second driving patterns

摘要

The weak-magnetic field sensor using printed circuit board manufacturing technique comprises a first base board (10) formed with electrically connected upper and lower first driving patterns (2), a pair of first stacked boards (20) formed with parallel magnetic layers, and a pair of second stacked boards (30) formed with second driving patterns (3) electrically connected to the first driving patterns and formed with pickup patterns (4). The weak-magnetic field sensor using printed circuit board manufacturing technique comprises: (a) a first base board which is formed at its upper and lower surfaces with first driving patterns such that the upper and lower first driving patterns are electrically connected to each other; (b) a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers to be parallel to each other; and (c) a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns electrically connected to the first driving patterns of the first base board to surround magnetic layers and formed with pickup patterns to surround the first and second driving patterns. An independent claim is also included for a method of manufacturing a weak-magnetic field sensor using printed circuit board manufacturing technique comprising: (a) providing first driving patterns on upper and lower surfaces of a first base board by forming first via holes (5) at the first base to connect the upper and lower driving patterns to each other followed by plating of the via-holes, exposing and etching; (b) preparing first stacked boards by stacking and pressing second base layers and magnetic layers on both sides of the first base board followed by exposing, developing and etching; (c) preparing second stacked boards by stacking and pressing second base layers and conductive layers on both sides of the first stacked board; (d) forming second via-holes at the first and second stacked boards, and forming through holes at the first base board and the first and second stacked boards; and (e) providing second driving patterns on the second stacked boards to be electrically connected to the first driving patterns by the second via-holes and to surround the magnetic layers, and providing pickup patterns on the upper and lower second stacked boards to be electrically connected to each other by the through holes and to surround the first driving patterns by plating, exposing, developing and etching the second stacked board.