首页> 外国专利> Process for improving the transfer of additive material to support used in the production of printed circuit boards comprises using template having openings with coating for the structured transfer of the additive material to the support

Process for improving the transfer of additive material to support used in the production of printed circuit boards comprises using template having openings with coating for the structured transfer of the additive material to the support

机译:改进在印刷电路板生产中使用的添加剂材料向载体的转移的方法包括使用具有开口的模板,该开口具有涂层,用于将添加剂材料结构化地转移至载体

摘要

Process for improving the transfer of additive material (3) to a support comprises using a template (1) having one or more openings (4) for the structured transfer of the additive material to the support. A coating is applied on the inner surfaces (9) of the openings and has a lower adhesion force compared with the additive material than the non-coated inner surfaces. An Independent claim is also included for a template for the structured transfer of an additive material to a support.
机译:用于改善添加剂材料(3)向载体的转移的方法包括使用具有一个或多个开口(4)的模板(1),用于将添加剂材料结构化地转移至载体。在开口的内表面(9)上施加涂层,并且与添加剂材料相比,涂层的粘附力比未涂层的内表面低。模板还包含独立权利要求,用于将添加剂材料结构化转移至载体。

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