首页> 外国专利> Micro manipulator for semiconductor integrated circuit manufacture/inspection, has three-link mechanisms fabricated into single unit, by cutting and folding sheet of flexible metal plate

Micro manipulator for semiconductor integrated circuit manufacture/inspection, has three-link mechanisms fabricated into single unit, by cutting and folding sheet of flexible metal plate

机译:用于半导体集成电路制造/检查的微操纵器,具有三连杆机构,通过切割和折叠柔性金属板制成单个单元

摘要

A three-link mechanism (6) connects a base (2) and end effector (3) and performs parallel three-degree-of-freedom (3-DOF) operation. The three-link mechanism are fabricated into single unit, by cutting and folding a sheet of flexible metal plate.
机译:三连杆机构(6)连接基座(2)和末端执行器(3),并执行并行的三自由度(3-DOF)操作。通过切割和折叠一块柔性金属板,将三连杆机构制成单个单元。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号