首页> 外国专利> Cooling body used for cooling an electronic component, especially a central processing unit chip of a computer is made from or coated with diamond

Cooling body used for cooling an electronic component, especially a central processing unit chip of a computer is made from or coated with diamond

机译:用于冷却电子部件(尤其是计算机的中央处理单元芯片)的冷却体由金刚石制成或涂有金刚石

摘要

Cooling body is made from or coated with diamond. Preferred Features: The cooling body has a base body made from metal on which a diamond coating is applied. The base body is made from silver or a silver alloy, copper or a copper alloy, or aluminum or an aluminum alloy. The base body has a slit (30) for inserting a holding clamp. The clamp is a spring clamp.
机译:冷却体由金刚石制成或涂有金刚石。优选特征:冷却体具有由金属制成的基体,在基体上施加了金刚石涂层。基体由银或银合金,铜或铜合金或铝或铝合金制成。基体具有用于插入固定夹的狭缝(30)。该夹具是弹簧夹具。

著录项

  • 公开/公告号DE20213087U1

    专利类型

  • 公开/公告日2003-03-06

    原文格式PDF

  • 申请/专利权人 PROJECT ENGINEERING GMBH;

    申请/专利号DE2002213087U

  • 发明设计人

    申请日2002-08-27

  • 分类号F28D21/00;H01L23/34;H01L23/373;H05K7/20;

  • 国家 DE

  • 入库时间 2022-08-21 23:41:21

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