首页> 外国专利> Modular unit for fan-less, high-computing power panel-computer, has one or more cooling walls mounted directly on assembly plate

Modular unit for fan-less, high-computing power panel-computer, has one or more cooling walls mounted directly on assembly plate

机译:用于无风扇,高性能计算机配电盘计算机的模块化单元,具有一个或多个直接安装在装配板上的冷却壁

摘要

A modular unit for panel-computer includes an assembly plate on the front- and/or rear-face of which are mounted the motherboard and/or back-plane with slot-CPU and/or all-in-one board and other boards with integrated processors. The board is arranged parallel, and /or parallel and at right-angles to the display; and/or the hard disk drives and/or the CD-ROM and/or working memory and other sub-assemblies are integrated on additional adapter plates. One and/or more cooling walls and/or cooling bodies are mounted directly and/or via spacer-retainers on the assembly plate or loosely as built-in elements. The heat arising in the processor is removed by one and/or several liquid coolers without fans, where the heat-removing part of the liquid cooler is placed directly on the surface of the processor by means of a plate and/or adapter system, and that of the liquid cooler is fixed by adapter plates and/or directly on the cooling wall.
机译:面板计算机的模块化单元包括一个装配板,该装配板的正面和/或背面分别安装了带有插槽CPU和/或多合一板的母板和/或背板以及其他带有插槽CPU的板。集成处理器。该板平行于和/或平行于显示器成直角布置;和/或硬盘驱动器和/或CD-ROM和/或工作存储器以及其他子组件集成在其他适配器板上。一个和/或多个冷却壁和/或冷却体直接和/或经由间隔保持器安装在组装板上,或作为内置元件宽松地安装。处理器中产生的热量由一个和/或几个不带风扇的液体冷却器除去,其中液体冷却器的散热部分通过板和/或适配器系统直接放置在处理器的表面,以及液体冷却器的温度通过转接板和/或直接固定在冷却壁上。

著录项

  • 公开/公告号DE20300770U1

    专利类型

  • 公开/公告日2003-03-13

    原文格式PDF

  • 申请/专利权人 RICHARD WOEHR GMBH;

    申请/专利号DE2003200770U

  • 发明设计人

    申请日2003-01-17

  • 分类号G06F1/00;

  • 国家 DE

  • 入库时间 2022-08-21 23:41:09

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