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Heat sink system for a CPU has contact heat sink plate coupled to thermally transmitting tube

机译:用于CPU的散热器系统具有连接至传热管的接触式散热器板

摘要

The CPU [1] plugs into a socket [3] on a base plate [2] and the heat sink plate of copper [4] is held in secure contact with the top surface. Generated heat energy is conducted through a tube [8] that is soldered to the heat sink plate. The heat energy is received by a copper plate [13] bonded to an acrylic heat conducting plate [14].
机译:CPU [1]插入基板[2]上的插槽[3]中,并且铜[4]的散热板与顶面保持牢固接触。产生的热能通过焊接在散热板上的管[8]传导。该热能由结合至丙烯酸类导热板[14]的铜板[13]接收。

著录项

  • 公开/公告号DE20308524U1

    专利类型

  • 公开/公告日2003-09-11

    原文格式PDF

  • 申请/专利权人 RICHARD WOEHR GMBH;

    申请/专利号DE2003208524U

  • 发明设计人

    申请日2003-05-30

  • 分类号G06F1/20;

  • 国家 DE

  • 入库时间 2022-08-21 23:40:47

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