EPOXY RESIN COMPOSITION FOR LOW TO ORDINARY TEMPERATURE CURING TYPE PREPREG, PREPREG AND ITS CURING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a hygienic safe epoxy resin composition for low to ordinary temperature curing type prepreg without trouble, the prepreg and its curing process.;SOLUTION: The epoxy resin composition for low to ordinary temperature curing type prepreg is composed essentially of (A) an epoxy compound having at least two or more glycidyl group in one molecule, (B) a polymercaptan compound and (C) a microencapsulated amine compound or (D) a compound potentially capable of stimulating the polymercaptan compound at ordinary temperatures. The ordinary temperature curing type prepreg produced by immersing the epoxy resin composition in reinforced fibers and a process for curing the prepreg at ordinary temperatures.;COPYRIGHT: (C)2004,JPO&NCIPI