首页> 外国专利> METHOD OF TRANSFERRING THIN FILM ELEMENT, THIN FILM ELEMENT, THIN FILM INTEGRATED CIRCUIT DEVICE, ACTIVE MATRIX SUBSTRATE, AND LIQUID CRYSTAL DISPLAY DEVICE

METHOD OF TRANSFERRING THIN FILM ELEMENT, THIN FILM ELEMENT, THIN FILM INTEGRATED CIRCUIT DEVICE, ACTIVE MATRIX SUBSTRATE, AND LIQUID CRYSTAL DISPLAY DEVICE

机译:转移薄膜元件,薄膜元件,薄膜集成电路装置,有源矩阵基板和液晶显示装置的方法

摘要

PPROBLEM TO BE SOLVED: To provide a novel technique by which a substrate used at the time of manufacturing a thin film element and another substrate (having a property desirable for the application of a product) used when, for example, the product is actually used can be selected independently and freely. PSOLUTION: After a separation layer (120) is provided on a highly reliable laser light-transmitting substrate (100), a thin film element (140), such as the TFT etc., is formed on the substrate (100). Then the element (140) is made to be peelable from the substrate (100) at the separation layer (120) by projecting laser light upon the layer (120) from the substrate (100) side. In addition, the element (140) is bonded to a transfer body (180) through an adhesive layer (160) and the substrate (100) is separated from the element (140). Consequently, a desired thin film device can be transferred to any kind of substrate. PCOPYRIGHT: (C)2004,JPO
机译:

要解决的问题:提供一种新颖的技术,通过该新颖的技术,制造薄膜元件时使用的基板和例如当产品使用时使用的另一基板(具有产品应用所需的特性)实际使用时可以独立自由选择。

解决方案:在高度可靠的激光透射基板(100)上设置隔离层(120)之后,在基板(100)上形成诸如TFT等的薄膜元件(140)。 。然后,通过将激光从基板(100)侧投射到层(120)上,使元件(140)在分离层(120)处可从基板(100)剥离。另外,元件(140)通过粘合剂层(160)结合到转移体(180),并且衬底(100)与元件(140)分离。因此,可以将期望的薄膜装置转移到任何种类的基板上。

版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004140381A

    专利类型

  • 公开/公告日2004-05-13

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20030382674

  • 申请日2003-11-12

  • 分类号H01L27/12;G02F1/1368;H01L21/20;H01L21/336;H01L29/786;

  • 国家 JP

  • 入库时间 2022-08-21 23:35:08

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