首页> 外国专利> ACTIVE ENERGY RAY CURING COMPOSITION, METHOD FOR FORMING CURED FILM USING THE SAME AND CURED PRODUCT THEREOF AND ANTIREFLECTION BODY

ACTIVE ENERGY RAY CURING COMPOSITION, METHOD FOR FORMING CURED FILM USING THE SAME AND CURED PRODUCT THEREOF AND ANTIREFLECTION BODY

机译:活性能量射线固化组合物,使用其相同固化产品形成抗弯膜的方法和抗弯体

摘要

PPROBLEM TO BE SOLVED: To provide a cured film having scuff resistance and excellent adhesiveness to both a plastic substrate and an antireflection film without forming an adhesiveness imparting layer such as a primer layer and to provide an antireflection body having both scuff resistance and antireflection properties. PSOLUTION: An active energy curing composition comprises 5-50 wt.% of a tetrahydrofuran ring-containing (meth)acrylate (A) and 50-95 wt.% of an active energy ray curing silica (B) prepared by reacting a compound having a functional group reactive with silanol groups and an ethylenically unsaturated double bond with the silica particle surface. A method for forming a cured film comprises coating the top surface of a plastic substrate with the composition and then irradiating the coated composition with electron beams. A cured product is prepared by coating the top surface of the plastic substrate with the composition and then irradiating the coated composition with the electron beams. The antireflection body is obtained by forming the antireflection film on the cured product. PCOPYRIGHT: (C)2004,JPO
机译:

要解决的问题:提供一种具有耐划伤性并且对塑料基材和抗反射膜均优异的粘合性的固化膜,而没有形成底漆层等粘合性赋予层,并且提供兼具耐划伤性和抗划伤性的抗反射体。防反射特性。

解决方案:活性能量固化组合物包含5-50 wt。%的含四氢呋喃环的(甲基)丙烯酸酯(A)和50-95 wt。%的通过能量反应制备的活性能量射线固化二氧化硅(B)具有与硅醇基反应的官能团和与二氧化硅颗粒表面的烯键式不饱和双键的化合物。形成固化膜的方法包括用该组合物涂覆在塑料基材的顶表面上,然后用电子束照射该涂覆的组合物。通过用组合物涂覆塑料基底的顶表面,然后用电子束照射涂覆的组合物来制备固化产物。通过在固化产物上形成抗反射膜来获得抗反射体。

版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004143201A

    专利类型

  • 公开/公告日2004-05-20

    原文格式PDF

  • 申请/专利权人 TOYO INK MFG CO LTD;

    申请/专利号JP20020306632

  • 发明设计人 SHIMADA KENSHIROU;OGATA KEIZO;

    申请日2002-10-22

  • 分类号C08F220/28;B32B7/02;B32B27/30;C08F292/00;C08J7/04;C09D4/02;C09D5/00;C09D157/00;C09D201/00;G02B1/10;G02B1/11;

  • 国家 JP

  • 入库时间 2022-08-21 23:34:36

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