PURPOSE: To provide an electronic cooling device in which its deterioration in performance is less and its has a long enduring life. ;CONSTITUTION: An electronic cooling device is comprised of a heat absorbing electrode 9, a heat radiating electrode 12, a P-type semiconductor layer 10 and an N-type semiconductor layer 11 arranged side-by-side between the heat absorbing side electrode 9 and the heat radiating side electrode 12, a heat absorbing substrate 1 arranged outside the heat absorbing side electrode 9 and a heat radiating substrate 2 arranged outside the heat radiating electrode 12. The heat absorbing side substrate 1 and the heat radiating substrate 2 are oppositely arranged to each other. The heat absorbing side electrode 9, P-type semiconductor layer 10 and the N-type semiconductor layer 11 and the heat radiating electrode 12 are arranged between both substrates. An O-ring 6 is placed at opposing parts of the heat absorbing substrate 1 and the heat radiating substrate 1 and at an entire circumference of an outer circumference where no electrode 9 (12) is applied and then both heat absorbing side substrate 1 and heat radiating side substrate 2 are fastened to each other. Seal agent 7 is filled in a groove formed by the opposing part and the O-ring 6 so as to apply a close fitness of the outer circumference between the heat absorbing substrate 1 and the heat radiating side substrate 2.;COPYRIGHT: (C)1994,JPO&Japio
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