首页> 外国专利> METHOD FOR MANUFACTURING ADHESIVE FRAME FOR SINGLE LAYER PANEL AND SINGLE LAYER PANEL, AND METHOD FOR MANUFACTURING ADHESIVE FRAME FOR MULTIPLE LAYER PANEL AND MULTIPLE LAYER PANEL

METHOD FOR MANUFACTURING ADHESIVE FRAME FOR SINGLE LAYER PANEL AND SINGLE LAYER PANEL, AND METHOD FOR MANUFACTURING ADHESIVE FRAME FOR MULTIPLE LAYER PANEL AND MULTIPLE LAYER PANEL

机译:用于单层面板和单层面板的粘合框架的制造方法以及用于多层面板和多层面板的粘合框架的制造方法

摘要

PROBLEM TO BE SOLVED: To solve the problems of a low yield of raw material and a high cost due to a large number of processes, for example four processes because three panels are horizontally bonded at first and subsequently laminated and bonded up and down when a three-layered panel is manufactured.;SOLUTION: An adhesive frame 1 for the single layer panel is constituted of a base part 1A, a press plate part 1B and a press part 1C. Panel-like woods 2A being the material of the panel are arranged in the case part 1A and the side surfaces of the panel-like woods are pressed by the press plate part 1B and the upper surfaces of the panel-like woods are pressed by the press part 1C.;COPYRIGHT: (C)2004,JPO
机译:要解决的问题:为了解决由于大量工序而导致的原料收率低和成本高的问题,例如四个工序,因为首先将三个面板水平粘合,然后在层压时将其上下层压并上下粘合。解决方案:解决方案:用于单层面板的粘合框架1由基部1A,压板部1B和压部1C组成。在壳体部1A中配置有作为板材的板材的木板状木材2A,并且通过按压板部1B对板材状木材的侧面进行按压,通过按压板部1B对板材状木材的上表面进行按压。出版社1C .;版权所有:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004050436A

    专利类型

  • 公开/公告日2004-02-19

    原文格式PDF

  • 申请/专利权人 MIDORIKAWA MOKUZAI KK;

    申请/专利号JP20020207095

  • 发明设计人 MIDORIKAWA MASUO;

    申请日2002-07-16

  • 分类号B27D3/00;B27M3/00;

  • 国家 JP

  • 入库时间 2022-08-21 23:32:06

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