ARAMID FIBER NONWOVEN FABRIC PREPREG, AND LAMINATED PLATE AND PRINTED-WIRING BOARD USING IT

摘要

PROBLEM TO BE SOLVED: To provide a prepreg capable to form an insulation layer responding to tendencies toward high density, weight reduction, thin plate and high rigidity of a multilayered printed-wiring board.;SOLUTION: The prepreg is prepared by holding a thermosetting resin in a nonwoven fine denier aramid fiber fabric with 10 μm or less, preferably 8 μm or less diameter. The prepreg is composed of the nonwoven aramid fiber fabric with preferable unit mass of 36 g/m² or less, more preferably 22 g/m². The insulating layer prepared by heating and press molding the prepreg has preferably a thickness of 50 μm or less, more preferably 40 μm or less per a sheet of the prepreg after heating and press molding. The thickness of the pre-preg is preferably 200-300% to that of the aramid fiber nonwoven fabric.;COPYRIGHT: (C)2004,JPO