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METHOD OF EVALUATING MOUNT POSITION PRECISION OF ELECTRONIC COMPONENT MOUNTING APPARATUS, TOOL AND DEDICATED SUBSTRATE FOR POSITION PRECISION EVALUATION
METHOD OF EVALUATING MOUNT POSITION PRECISION OF ELECTRONIC COMPONENT MOUNTING APPARATUS, TOOL AND DEDICATED SUBSTRATE FOR POSITION PRECISION EVALUATION
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机译:评估用于位置精度评估的电子组件安装设备,工具和专用基材的安装位置精度的方法
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摘要
PROBLEM TO BE SOLVED: To provide a method for evaluating mount position precision of an electronic component mounting apparatus which has high precision and superior durability and can use a recognizing method by the same reflection illumination with an actual machine, and a tool and a dedicated substrate for position precision evaluation.;SOLUTION: For the mount position precision evaluation of the electronic component mounting apparatus which detects a position of mounting by a mount head shifting from a target mount position on control data, the tool 10 held as a dummy component for component recognition on a nozzle 3a is characterized in that a shape pattern 13 allowing light transmission only in a range corresponding to a lead of the electronic component is formed on the reverse surface of a transparent plate member 11 corresponding to the electronic component to be evaluated, white reflecting paper 12 which diffuses and reflects illumination light made incident from the reverse surface side is stuck on the top surface of the plate member 11 within the range of the shape pattern 13, and a scale pattern 14 for detecting a position shift from a mount position reference part is formed outside the shape pattern 13.;COPYRIGHT: (C)2004,JPO
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