Silicon micromachined gyroscope using tuned accelerometer

摘要

I is formed by a micromachined from a silicon wafer, the silicon tuned accelerometer gyroscope micromachined. Top portion and a cover for covering the bottom surface, has a guard ring elements for driver, forcer for, and tuning, parts of which are micromachined in the form of an array on an SOI wafer. Elements in the center between the bottom portion and the top portion (the driven-sensing element) are micromachined in the form of an array of silicon wafer 4 inches wide. Driven and driving detection structure is a tuned pendulum attached to the vibrating structure by flexure joint, towards the vibrating structure is supported by a supporting member of the dither parallelogram. The pendulum is in the form of tuned to match the natural frequency of the vibrating structure the natural frequency of the pendulum by adjusting the amplitude of the DC signal. Shape of the dither support member flexure of the vibrating structure is defined in the unique, yet can be easily machined, but in addition, to achieve a dither support member that holds within its vibration plane vibration structure without high frequency distortion.