The bar block for the thin film component which has the sensor and the said sensor for grinding and the wafer substrate null for the thin film component which has the said

摘要

PROBLEM TO BE SOLVED: To make detectable whether or not an electric short circuit is caused and to make accurately and surely detectable a polishing position by forming a polishing sensor integrally with a polished body and electrically short-circuiting the polishing sensor by polishing the sensor itself. ;SOLUTION: On a wafer substrate, many tunneling magnetoresistance effect (TMR) type thin film magnetic heads are formed in matrix and in the same filming process, polishing sensors are formed at the same time and cut into bar blocks 20. Each bar block 20 includes TMR elements 21 and 22 having two yoke parts 21a and 22a of the yoke type TMR type thin film magnetic heads and two polishing sensors 23 and 24 among the polishing sensors. The polishing sensor 23 has its edge end 23a formed in level with a desirable ABS (floating surface) 25 and the polishing sensor 24 has its edge end 24a formed a little in front of the ABS 25. Consequently, multiple polishing positions can be detected.;COPYRIGHT: (C)2001,JPO