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The method of producing the territory where it does not have the polymer on the baseplate

机译:产生在基板上没有聚合物的区域的方法

摘要

As for this invention, as for the aforementioned method, it installs one peeling layer, at least on the baseplate in regard to the method of producing the territory where it does not have the polymer on the baseplate, at the same time/or it installs with respect to the polymer layer which is arranged on the baseplate, that it is characterized in forming the territory where it does not have the polymer at the place where it installs on the baseplate by removing peeling layer. Therefore, as for this invention, between the baseplate and the diode protective cap, airtightness connection is offered by installing the diode protective cap with respect to the territory where it does not have the polymer of method or the baseplate which forms the connection territory which does not have the polymer.
机译:就本发明而言,关于前述方法,关于在基板上不具有聚合物的产生区域的制造方法,至少在基板上同时设置一个剥离层,或者/对于布置在基板上的聚合物层,其特征在于通过去除剥离层在其安装在基板上的位置处形成不具有聚合物的区域。因此,对于本发明,在基板与二极管保护罩之间,通过相对于不具有方法的高分子的区域或形成有连接区域的基板设置二极管保护罩,来进行气密连接。没有聚合物。

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