Thick film extremely high frequency tranceiver module

摘要

Thick film extremely high frequency tranceiver module, includes with the multilayer baseplate which possesses the plural layers of the low temperature copying tape which is received on the baseplate and the baseplate. There are various ones in various layers. To include with DC signal plane and possess earthing connection ground layer and the device layer where the condenser and the resistor were imbedded and possesses the clipping in order among those to receive MMIC tip/chip the upper layer which possess the signal track/truck which it is connected it is possible layer. Solder preform layer, because MMIC tip/chip is locked, is located between device layer and upper layer. The channelization plate is received on the multilayer baseplate, in order to actualize separation between the receipt and transmission signal and the reception signal, the channel is formed MMIC tip/chip.