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The alumina silica compound powder is produced the low temperature sintering ceramic

机译:氧化铝二氧化硅复合粉生产的低温烧结陶瓷

摘要

PURPOSE:To enhance bending strength and to lower dielectric constant by a method wherein alumina-silica composite powder is manufactured by having alumina powder coated with a silicon oxide, this alumina-silica compound powder is mixed with bismuth trioxide powder, and the mixture is sintered after molding. CONSTITUTION:Alumina-silica composite powder is manufactured by coating a silicon oxide on the surface of alumina powder of 0.1 to 5.0mum in average diameter for example. This composite powder and a bismuth oxide powder are mixed, a solvent, a binder, a dispersant and the like are added thereto, they are kneaded and formed into paste. After this paste has been formed into a green sheet by doctor blade method for example, the green sheet is sintered at 1100 deg.C or lower, and a low temperature sintered ceramic substrate is obtained. At this point, after conductive paste has been screen-printed on the green sheet, a plurality of green sheets are laminated, they are sintered, and a multilayer wiring substrate is obtained.
机译:用途:为提高弯曲强度并降低介电常数,是通过在氧化铝粉末上涂上氧化硅的方法制造氧化铝-二氧化硅复合粉末,将该氧化铝-二氧化硅复合粉末与三氧化二铋粉末混合,然后将混合物烧结成型后。组成:氧化铝-二氧化硅复合粉末是通过在平均直径为0.1-5.0μm的氧化铝粉末表面涂覆一层氧化硅而制成的。将该复合粉末和氧化铋粉末混合,向其中添加溶剂,粘合剂,分散剂等,将它们捏合并形成糊剂。例如,通过刮刀法将该糊剂形成为生片之后,在1100℃以下对生片进行烧结,从而得到低温烧结的陶瓷基板。此时,在将导电浆料丝网印刷在生片上之后,将多个生片层压,将它们烧结,从而获得多层配线基板。

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