METHOD FOR ALIGNING BY LIQUID OF MICROSPHERE, METHOD FOR FORMING BUMP ELECTRODE, MICROSPHERE-ALIGNING APPARATUS AND CONDUCTIVE LIQUID

摘要

PROBLEM TO BE SOLVED: To provide a method for aligning microspheres by a liquid, which can reduce the number of steps as much as possible at a bump electrode forming time by efficiently housing the microspheres in a pad forming hole of a semiconductor device so as not to project by a small vibration or impact, and to provide a method for forming a bump electrode, a microsphere aligning apparatus and a conductive liquid.;SOLUTION: The method for aligning the microspheres comprises the steps of mounting a semiconductor device 2 having the semiconductor wafer 22 having predetermined semiconductor element and wirings on a mounting base 3d and having many pads 21 connected to predetermined wirings and a resist 25 formed with a hole 24 passing to mount the microspheres 23, at the position of each pad 21 on the semiconductor wafer 22; injecting the microspheres 23, together with the liquid mixed with a flux 30 from a microsphere supply nozzle 9 to the upper part of the device 2; casting the microspheres 23 in the hole 24 to be mounted on the pad 21; and the steps of conveying the device 2 to a reflow furnace; heating the device 2 to melt the microspheres 23, cooling the microspheres, peeling a resist 25, to thereby form a bump electrode 23.;COPYRIGHT: (C)2004,JPO