MICRO-ETCHING AGENT FOR COPPER AND COPPER ALLOY AND METHOD FOR MICRO-ROUGHENING COPPER OR COPPER ALLOY BY USING THE AGENT

摘要

PPROBLEM TO BE SOLVED: To provide a micro-etching agent for a copper and copper alloy, which can roughen the surfaces of copper and the copper alloy, and to provide a method for micro-roughening the copper or the copper alloy by using the etching agent. PSOLUTION: The micro-etching agent for the copper and the copper alloy contains a compound (A) selected from the group consisting of sulfuric acid, alkane sulfonic acid, alkanol sulfonic acid and a derivative thereof, peroxide (B), a compound (C) selected from the group consisting of tetrazole and a derivative thereof, and ions (D) of metal with nobler potential than copper (excepting ions of silver when the component (A) is sulfuric acid). The method for micro-roughening copper or the copper alloy uses the etching agent. Since the surfaces of the copper alloy and the copper alloy are efficiently roughened, not only adhesion with a resin layer can sufficiently be obtained even if etching is not deeply performed, but also, sufficient roughening is made possible even to a rolled article of the copper alloy such as a lead frame to which roughening has been difficult heretofore with the micro-etching agent for the copper and the copper alloy. PCOPYRIGHT: (C)2004,JPO