首页> 外国专利> PROCESSING APPARATUS HAVING AT LEAST TWO SPATIAL UNITS, IN WHICH DENSITY OF CONTAMINATED PARTICLE IS RESPECTIVELY REDUCED AS COMPARED WITH AMBIENTS

PROCESSING APPARATUS HAVING AT LEAST TWO SPATIAL UNITS, IN WHICH DENSITY OF CONTAMINATED PARTICLE IS RESPECTIVELY REDUCED AS COMPARED WITH AMBIENTS

机译:具有至少两个空间单位的处理设备,其被污染粒子的密度与环境相比分别降低了

摘要

PROBLEM TO BE SOLVED: To provide an arrangement wherein the density of contaminated particles is reduced so as to be smaller in a spatial unit, more sensitive in relation to the contaminated particles between two sets of the spatial unit in a processing apparatus for manufacturing a semiconductor.;SOLUTION: The first spatial unit 21 and the second spatial unit 22, in which the density of contaminated particles is reduced compared with the ambients thereof, respectively, are provided while a first laminar flow 41 having a first flow rate and a second laminar flow 42 having a second flow rate are parallel in relation to each other. The first spatial unit 21 is connected to the second spatial unit 22 by a third spatial unit 23 so as to transport a semiconductor disk while a third laminar flow 43 having a third flow rate is orthogonal to the first laminar flow 41 and the second laminar flow 42.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种布置,其中在用于制造半导体的处理设备中,减小污染颗粒的密度以使其在空间单位中较小,相对于两组空间单元之间的污染颗粒更敏感解决方案:提供第一空间单元21和第二空间单元22,其中,与环境相比,分别降低了污染颗粒的密度,同时具有第一流速和第二层流的第一层流41具有第二流率的流42彼此平行。第一空间单元21通过第三空间单元23连接到第二空间单元22,以便在具有第三流速的第三层流43与第一层流41和第二层流正交的同时输送半导体盘。 42 .;版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004006626A

    专利类型

  • 公开/公告日2004-01-08

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号JP20020375626

  • 发明设计人 LEDERER KAY;HORNIG STEFFEN;

    申请日2002-12-25

  • 分类号H01L21/68;B65G49/00;H01L21/027;

  • 国家 JP

  • 入库时间 2022-08-21 23:23:50

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