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The ITO sintering body and its production manner and membrane manner null of the ITO film which uses the aforementioned ITO sintering
The ITO sintering body and its production manner and membrane manner null of the ITO film which uses the aforementioned ITO sintering
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机译:使用上述ITO烧结的ITO膜的ITO烧结体及其制造方式和膜方式无效
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摘要
PROBLEM TO BE SOLVED: To obtain ITO coating having stable transparency and electric conductivity and furthermore free from defects such as pinholes. SOLUTION: The raw material of an ITO sintered compact consisting essentially of indium oxide and tin oxide is incorporated with SiO2 and MgO or SiO2 , MgO and Al2 O3 respectively in prescribed rations, which is subjected to compressive molding under relatively low pressure of 0.2 to 20MPa into a pellet shape or the like, and heating and sintering are executed. When ITO coating is formed by vacuum-deposition or sputtering with this ITO sintered compact as an evaporating source or a target, the ITO coating having a tin content same as that in the ITO sintered compact and furthermore free from pinholes or the like can be formed.
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