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Heat pipe thermal management of high potential electronic chip packages
Heat pipe thermal management of high potential electronic chip packages
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机译:高潜力电子芯片封装的热管热管理
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摘要
An improved electronic chip package is disclosed, which may include an electrical insulator, top and bottom metallization layers associated with said insulator, an integrated circuit (IC) device, and a heat pipe placed between the electrical insulator and the IC device, and soldered to the IC device, wherein the wall of the heat pipe may be constructed so that thermal stresses in the IC device are reduced.
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