首页> 外国专利> Plasma processing apparatus capable of performing uniform plasma treatment by preventing drift in plasma discharge current

Plasma processing apparatus capable of performing uniform plasma treatment by preventing drift in plasma discharge current

机译:通过防止等离子体放电电流的漂移能够进行均匀的等离子体处理的等离子体处理装置

摘要

A plasma processing apparatus has a plasma processing chamber that accommodates an electrode pair of a plasma excitation electrode for exciting plasma and a susceptor electrode facing the plasma excitation electrode, a workpiece to be treated being placed therebetween. The apparatus also has a chassis that accommodates an impedance matching circuit, provided in the middle of a supply path for feeding RF power from an RF generator to the plasma excitation electrode, for matching the impedance between the RF generator and the plasma processing chamber. In the chassis, impedances are axisymmetrically equal at a predetermined frequency with respect to the direction of a high-frequency current returning to the RF generator. The matching circuit has at least two inductance coils connected in parallel.
机译:等离子体处理装置具有等离子体处理室,该等离子体处理室容纳有一对用于激发等离子体的等离子体激发电极和与该等离子体激发电极相对的基座电极的电极对,将被处理的工件置于其间。该设备还具有底盘,该底盘容纳阻抗匹配电路,该阻抗匹配电路设置在用于将RF功率从RF发生器馈送到等离子体激发电极的供应路径的中间,以匹配RF发生器和等离子体处理室之间的阻抗。在机架中,相对于返回到RF发生器的高频电流的方向,阻抗在预定频率上轴对称相等。匹配电路具有至少两个并联的电感线圈。

著录项

  • 公开/公告号US6750614B2

    专利类型

  • 公开/公告日2004-06-15

    原文格式PDF

  • 申请/专利权人 ALPS ELECTRIC CO. LTD.;OHMI TADAHIRO;

    申请/专利号US20030348934

  • 发明设计人 AKIRA NAKANO;TADAHIRO OHMI;

    申请日2003-01-21

  • 分类号H05H14/60;

  • 国家 US

  • 入库时间 2022-08-21 23:18:39

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