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Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide

机译:光敏性聚酰亚胺树脂前体组合物,由该组合物获得的光学聚酰亚胺,使用该聚酰亚胺的光波导以及制造该光波导的方法

摘要

A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5-50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.
机译:能够提供基本上不着色,透明且具有耐热性的聚酰亚胺树脂的感光性聚酰亚胺树脂前体组合物,由该组合物得到的光学聚酰亚胺树脂和使用该聚酰亚胺树脂的光波导。感光性聚酰亚胺树脂前体组合物含有(a)由四羧酸二酐和二胺得到的聚酰胺酸100重量份,(b)0.01重量份以上且小于5重量份的1,4-。二氢吡啶衍生物,(c)5-50重量份的二醇(醚)。通过用UV光照射光敏树脂前体组合物,然后曝光,加热,显影,然后加热,获得光学聚酰亚胺树脂。该光波导包括包含光学聚酰亚胺树脂的芯层及其包层。

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