首页> 外国专利> Fenton's reagent composition for chemical-mechanical polishing, method of using same, and substrate treated with same

Fenton's reagent composition for chemical-mechanical polishing, method of using same, and substrate treated with same

机译:用于化学机械抛光的芬顿试剂组合物,其使用方法以及用该试剂处理过的基材

摘要

The present invention provides a composition for chemical-mechanical polishing which comprises an oxidizing agent, an abrasive, and a Fenton's reagent. The oxidizing agent comprises a per compound, such as periodic acid, a peroxide, or a persulfate. The abrasive comprises a metal oxide, such as colloidal silica, alumina, or spinel. The Fenton's reagent comprises a metal selected from a group consisting of metals in Group 1(b) and Group 8, such as iron, copper and silver. The composition is believed to be effective by virtue of the interaction between the oxidizing agent and the Fenton's reagent that is at least partially linked to the surface of the abrasive. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced this method.
机译:本发明提供了用于化学机械抛光的组合物,其包含氧化剂,磨料和芬顿试剂。氧化剂包括过化合物,例如高碘酸,过氧化物或过硫酸盐。磨料包括金属氧化物,例如胶体二氧化硅,氧化铝或尖晶石。芬顿试剂包含选自第1(b)族和第8族金属的金属,例如铁,铜和银。由于氧化剂和至少部分连接到磨料表面的芬顿试剂之间的相互作用,认为该组合物是有效的。本发明进一步提供了一种在组合物的抛光中在基材表面上抛光特征或层(例如金属膜)的方法。本发明另外提供了用该方法生产的基材。

著录项

  • 公开/公告号US2004025444A1

    专利类型

  • 公开/公告日2004-02-12

    原文格式PDF

  • 申请/专利权人 EKC TECHNOLOGY INC.;

    申请/专利号US20030393542

  • 发明设计人 XIAOWEI C. SHANG;ROBERT J. SMALL;

    申请日2003-03-19

  • 分类号C09G1/02;C09G1/04;B24B1/00;

  • 国家 US

  • 入库时间 2022-08-21 23:18:05

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