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Method for avoiding false failures attributable to dummy interconnects during defect analysis of an integrated circuit design

机译:避免在集成电路设计的缺陷分析过程中由于虚假互连而引起的错误故障的方法

摘要

A method for avoiding false failures attributable to dummy interconnects during defect analysis of an integrated circuit design is described. Described processing includes retrieving conductivity layers information for an integrated circuit design from a GDSII formatted file; defining a dummy polygons layer and a target layer; restoring interconnect polygons from the conductivity layers information into the dummy polygons layer; copying the interconnect polygons from the dummy polygons layer to the target layer, except for dummy interconnect polygons; and performing defect analysis of the integrated circuit design using the target layer.
机译:描述了一种用于避免在集成电路设计的缺陷分析期间归因于虚设互连的错误故障的方法。所描述的处理包括从GDSII格式的文件中检索用于集成电路设计的导电层信息;以及定义虚拟多边形层和目标层;从导电层信息中将互连多边形恢复到虚拟多边形层中;将互连多边形从虚拟多边形层复制到目标层,虚拟互连多边形除外;使用目标层对集成电路设计进行缺陷分析。

著录项

  • 公开/公告号US2003229867A1

    专利类型

  • 公开/公告日2003-12-11

    原文格式PDF

  • 申请/专利权人 BAKARIAN SERGEI;SEGAL JULIE;

    申请/专利号US20020167039

  • 发明设计人 SERGEI BAKARIAN;JULIE SEGAL;

    申请日2002-06-11

  • 分类号G06F9/45;G06F17/50;

  • 国家 US

  • 入库时间 2022-08-21 23:17:14

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