Embedded chip enclosure with solder-free interconnect

摘要

A fused silica substrate is processed to a thickness that allows it to be easily flexed. An opening is etched in the substrate. A die having a patterned topside is processed to the thickness of the substrate by lapping the die. The thinned die is positioned within the opening of the substrate. Non-conducting glass is then spun on top and backside surfaces of the die/substrate combination and is allowed to flow between the surfaces of the die and substrate. Conductive traces are constructed to provide electrical connection from the embedded die to the periphery of the enclosure for external electrical interconnect. The flexural properties of the thin fused silica (or equivalent) permit the enclosure to be arched and inserted into a printed circuit board without solder.