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Vapor growth method for metal oxide dielectric film and pzt film

机译:金属氧化物介电膜和pzt膜的气相生长方法

摘要

For forming a metal-oxide dielectric film having a perovskite type of crystal structure represented by ABO3 on a base conductor material using organometallic source gases, initial perovskite crystal nuclei or an initial amorphous layer having an amorphous structure are formed on the base conductor material under the first deposition conditions; and a film having a perovskite crystal structure is further grown on the initial crystal nuclei or the initial amorphous layer under the second deposition conditions. In the process, the first deposition conditions meet at least one of the requirements: (a) a lower substrate temperature than that in the second deposition conditions; and (b) a higher source gas pressure than that in the second deposition conditions. This process can be used to deposit a film such as PZT exhibiting a reduced leak current.
机译:为了使用有机金属原料气体在基础导体材料上形成具有由ABO 3 表示的钙钛矿型晶体结构的金属氧化物电介质膜,需要初始钙钛矿晶体核或具有非晶结构的初始非晶层。在第一沉积条件下在基础导体材料上形成;在第二沉积条件下,在初始晶核或初始非晶层上进一步生长具有钙钛矿晶体结构的膜。在该工艺中,第一沉积条件满足至少一个条件:(a)低于第二沉积条件的衬底温度; (b)比第二沉积条件下更高的源气体压力。该工艺可用于沉积具有减小的漏电流的膜,例如PZT。

著录项

  • 公开/公告号US2004058492A1

    专利类型

  • 公开/公告日2004-03-25

    原文格式PDF

  • 申请/专利权人 TATSUMI TORU;

    申请/专利号US20030471104

  • 发明设计人 TORU TATSUMI;

    申请日2003-09-08

  • 分类号H01L21/31;H01L21/8242;H01L21/469;

  • 国家 US

  • 入库时间 2022-08-21 23:16:22

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