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Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method
Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method
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机译:用于倒装芯片接头和板对板焊点的精细焊盘间距有机电路板和方法
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摘要
A fine pad pitch organic circuit board with plating solder and a method for fabricating the circuit board with plating solder are provided. The circuit board is formed with a plurality of densely arranged contact pads on at least a surface thereof in the absence of solder mask being applied over the surface. After deposition of a conductive seed layer on the contact pads, a resist layer is applied over the surface of the circuit board, and formed with a plurality of openings for exposing the seed layer corresponding in position to the contact pads. Then, a solder material is deposited in the openings by a plating method. Finally, the resist layer and the seed layer underneath the resist layer are removed, making the circuit board readily subject to subsequent fabrication processes for forming flip-chip joints or board-to-board joints.
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