Balun and semiconductor device including the balun

摘要

A balun includes a first conductive layer disposed on a top surface of a substrate, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, a substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and the third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.