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High-reliability interposer for low cost and high reliability applications

机译:适用于低成本和高可靠性应用的高可靠性中介层

摘要

An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.
机译:插入器在LGA连接器和母板之间提供了高可靠性的接口。插入件包括用于每个焊料互连的阶梯状间隔物,其在确保每个焊料互连的完整性的同时防止机械接触力的松弛。中介层在第一表面上提供镀有贵金属的接触垫,以容纳LGA连接器的接触部件,以及用于BGA焊料连接的接触垫,以连接至母板。还公开了制造中介层的过程的描述。

著录项

  • 公开/公告号US6723927B1

    专利类型

  • 公开/公告日2004-04-20

    原文格式PDF

  • 申请/专利权人 HIGH CONNECTION DENSITY INC.;

    申请/专利号US20010866434

  • 发明设计人 ZHINENG FAN;AI D. LE;CHE-YU LI;

    申请日2001-05-29

  • 分类号H01R120/40;H05K11/10;

  • 国家 US

  • 入库时间 2022-08-21 23:14:04

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