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Printer, printer head and method of producing the print head to promote reliable bonding of print head structures

机译:打印机,打印机头和制造该打印头以促进打印头结构的可靠结合的方法

摘要

A printer, a printer head, and a method of producing the printer head in which ink drops are caused to flow out by heat, so that an orifice plate can be bonded by sufficiently bringing it into close contact with that to which it is to be bonded. The printer head is formed by successively placing predetermined materials upon each other on a semiconductor substrate of a semiconductor device, and at least one of the lamination materials placed upon each other on the semiconductor substrate is smooth so that a surface where a plate-shaped material forming a nozzle is disposed is smooth.
机译:打印机,打印机头以及制造该打印机头的方法,其中墨滴由于热而流出,从而可以通过使孔板与要被放置的孔板充分接触来粘结孔板。保税的。通过将预定材料彼此连续地放置在半导体器件的半导体基板上来形成打印机头,并且在半导体基板上彼此放置的层压材料中的至少一种是光滑的,使得板状材料的表面形成喷嘴布置是平滑的。

著录项

  • 公开/公告号US6685304B2

    专利类型

  • 公开/公告日2004-02-03

    原文格式PDF

  • 申请/专利权人 SONY CORPORATION;

    申请/专利号US20010053468

  • 发明设计人 TAKAAKI MIYAMOTO;

    申请日2001-11-07

  • 分类号B41J20/50;H05B30/00;

  • 国家 US

  • 入库时间 2022-08-21 23:13:24

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