首页> 外国专利> Soldering paste for hard-soldering and coating aluminum and aluminum alloys

Soldering paste for hard-soldering and coating aluminum and aluminum alloys

机译:用于铝和铝合金的硬焊和涂层的焊膏

摘要

A soldering paste for hard-soldering and coating working parts made of aluminum or aluminum alloys, which contains 25 to 35 percent in weight of a water-miscible organic binding agent on the basis of aliphatic glycols, 25 to 45 percent in weight of an aluminum hard-soldering powder, 25 to 45 percent in weight of an aluminum fluxing agent and, as an additive to influence the rheological properties, 0.01 to 0.2 percent by weight with respect to the total amount of one or several fatty acids with 10 to 20 C atoms and/or their ammonium salts.
机译:一种用于铝或铝合金制成的硬质焊接和涂层工作部件的焊膏,该焊膏包含25-35%(重量)的水溶性有机粘合剂(基于脂肪族二醇),25-45%(铝)硬质焊接粉末,重量百分比为25%至45%的铝助熔剂,作为影响流变性能的添加剂,相对于一种或几种脂肪酸的总量为10%至20%为0.01%至0.2%(重量)原子和/或其铵盐。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号