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A NOVEL STI SCHEME TO PREVENT FOX RECESS DURING PRE-CMP HF DIP

机译:一种新的STI方案以防止CMP前HF DIP期间的狐狸应力

摘要

ABSTRACTA NOVEL STI SCHEME TO PREVENT FOX RECESS DURING PRE-CMP HF DIPA new method is provided for the creation of STI regions.STI trenches are created in the surface of a substrate followingconventional processing. A layer of STI oxide is deposited and,using an exposure mask that is a reverse mask of the mask that isused to create the STI pattern, impurity implants are performedinto the surface of the deposited layer of STI oxide. In view ofthese processing conditions, the layer of STI oxide overlying thepatterned layer of etch stop material is exposed to the impurityimplants. This exposure alters the etch characteristics of thedeposited layer of STI oxide where this STI oxide overlies thepatterned layer of etch stop material. The etch rate of theimpurity exposed STI oxide is increased by the impurityimplantation, resulting in an etch overlying the patterned etchstop layer that proceeds considerably faster than the etch of theSTI oxide that is deposited overlying the created STI trenches.With the significantly faster etch of the STI oxide where thisoxide has been exposed to impurity implantation, the STI oxideremoval can be equalized between the STI oxide that overlies thepatterned etch stop layer and the oxide that has been depositedover the STI trenches.FIGURE 9
机译:抽象一种新的STI方案以防止CMP前HF DIP期间的狐狸应力提供了一种用于创建STI区域的新方法。随后在衬底表面上形成STI沟槽常规处理。沉积一层STI氧化物,使用曝光遮罩,即曝光遮罩的反向遮罩用于创建STI模式,进行杂质注入进入STI氧化物沉积层的表面。以...的观点在这些处理条件下,STI氧化物层覆盖蚀刻停止材料的图案化层暴露于杂质植入物。这种暴露改变了硅片的蚀刻特性。STI氧化物的沉积层,该STI氧化物覆盖蚀刻停止材料的图案化层。蚀刻速率杂质暴露的STI氧化物因杂质而增加注入,导致蚀刻覆盖图案化蚀刻停止层的进行速度比蚀刻的停止层快得多沉积在生成的STI沟槽上方的STI氧化物。随着STI氧化物蚀刻速度的显着提高,氧化物已经暴露在杂质注入中,即STI氧化物可以使覆盖在表面的STI氧化物之间的去除量相等图案化的蚀刻停止层和已沉积的氧化物在STI海沟上。图9

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