首页> 外国专利> A method of molding a peripherally encapsulated piece of glass under heat and pressure using molding compound presented in a sheet material (smc) or bulk molding compound (BMC), and a door glass piece.

A method of molding a peripherally encapsulated piece of glass under heat and pressure using molding compound presented in a sheet material (smc) or bulk molding compound (BMC), and a door glass piece.

机译:一种使用存在于片材(smc)或块状模塑料(BMC)中的模塑料和门玻璃在热和压力下模制外围封装的玻璃的方法。

摘要

Method of molding a product having a peripheral encapsulation, said method comprising the steps of: (a) providing a multipartite mold including at least two bodies (51, 52) of the mold which are capable of being displaced relative to each other and define They are closed continuous annular chamber (60) of the mold which is open towards the inside and inside the annular chamber opposing mold clamping portions (74, 101) of the mold; (B) placing a piece of glass (15) between the parts (74, 101) are mold holding portions when the mold bodies are in a position that they are open; (C) heating at least one of the mold bodies; (D) placing thermosetting polymeric material upon the heated mold body within and throughout an area corresponding to the annular chamber (60) and on the outside with respect to a substantially continuous peripheral edge (18) of the glass piece; (E) hold the glass piece (15) between the parts (74, 101) of the mold which are holding portions; (F) moving relative progressively bodies (51, 52) of the mold taking them to the closed position thereof to thereby create compression forces which extrude the thermosetting polymeric material thus causing the same fill ring (60) chamber and perform a complete encapsulation of the continuous peripheral edge (18) including within said encapsulation surfaces of the opposite faces and a surface of the peripheral edge; (G) curing the thermosetting polymeric material by applying heat and pressure while the mold is in its position in which it is closed; (H) relatively moving the bodies (51, 52) of the mold taking them to their position in that they are open; and (i) withdrawing from the chamber (60) of the mold product peripherally encapsulated.
机译:模制具有外围封装的产品的方法,所述方法包括以下步骤:(a)提供包括模具的至少两个本体(51、52)的多部件模具,所述本体能够相对于彼此移位并限定它们闭合的模具连续环形腔室(60)朝着与模具的模具夹持部分(74、101)相对的环形腔室的内部和内部敞开。 (B)当模具体处于打开状态时,在作为模具保持部的部分(74、101)之间放置一块玻璃(15); (C)加热至少一个模具体; (D)相对于玻璃片的基本上连续的周缘(18),在与环形腔室(60)相对应的区域内和整个区域内以及在与外部连续的外侧上,将热固性聚合物材料置于加热的模具主体上; (E)将玻璃片(15)保持在作为保持部分的模具的部分(74、101)之间; (F)使模具的相对主体(51、52)逐渐运动,使它们到达其关闭位置,从而产生挤压力,该挤压力挤压热固性聚合物材料,从而导致相同的填充环(60)腔室并完全密封模具。连续的外围边缘(18),包括在相对表面的所述封装表面和外围边缘的表面内; (G)在模具处于其关闭位置时通过施加热量和压力来固化热固性聚合物材料; (H)使模具的主体(51、52)相对运动,使其处于打开状态; (i)从被外围封装的模具产品的腔室(60)中抽出。

著录项

  • 公开/公告号ES2211405T3

    专利类型

  • 公开/公告日2004-07-16

    原文格式PDF

  • 申请/专利权人 GEMTRON CORPORATION;

    申请/专利号ES20000106515T

  • 发明设计人 BIENICK CRAIG;HERRMANN BOB;DALEY HOWARD;

    申请日2000-03-25

  • 分类号B29C43/18;B29C70/76;B29C70/86;

  • 国家 ES

  • 入库时间 2022-08-21 23:05:27

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