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DEVICE AND METHOD FOR DETERMINING THE ORIENTATION OF A CRYSTALLOGRAPHIC PLANE IN RELATION TO A CRYSTAL SURFACE AND DEVICE FOR CUTTING A SINGLE CRYSTAL IN A CUTTING MACHINE
DEVICE AND METHOD FOR DETERMINING THE ORIENTATION OF A CRYSTALLOGRAPHIC PLANE IN RELATION TO A CRYSTAL SURFACE AND DEVICE FOR CUTTING A SINGLE CRYSTAL IN A CUTTING MACHINE
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机译:确定晶体平面相对于晶体表面的取向的装置和方法以及用于在切割机中切割单个晶体的装置
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摘要
The present invention relates to a kind of device and a kind of method,For determining orientation crystal face (100) and crystal face (2). The method allows to orient, and wherein the crystal of adhesive defect or the crystal of pollution fixing element are eliminated. For this reason,Angle, it is by the plane of crystal to be measured and benchmark and angle, it is by crystal face and reference measurement and Difference Calculation. Required correction then makes in a kind of wire sawing apparatus, including X-Y positioning units, passes through measurement orientation with horizontal and vertical position and adjusts crystal. Which ensure that additional rotary freedom is kept on crystal-cut face, realizes that cutting lacks power perpendicular to feed direction and longitudinal direction, do not deflect tool and cutting force minimum. Again improve orientation accuracy.
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