首页> 外国专利> DEVICE AND METHOD FOR DETERMINING THE ORIENTATION OF A CRYSTALLOGRAPHIC PLANE IN RELATION TO A CRYSTAL SURFACE AND DEVICE FOR CUTTING A SINGLE CRYSTAL IN A CUTTING MACHINE

DEVICE AND METHOD FOR DETERMINING THE ORIENTATION OF A CRYSTALLOGRAPHIC PLANE IN RELATION TO A CRYSTAL SURFACE AND DEVICE FOR CUTTING A SINGLE CRYSTAL IN A CUTTING MACHINE

机译:确定晶体平面相对于晶体表面的取向的装置和方法以及用于在切割机中切割单个晶体的装置

摘要

The present invention relates to a kind of device and a kind of method,For determining orientation crystal face (100) and crystal face (2). The method allows to orient, and wherein the crystal of adhesive defect or the crystal of pollution fixing element are eliminated. For this reason,Angle, it is by the plane of crystal to be measured and benchmark and angle, it is by crystal face and reference measurement and Difference Calculation. Required correction then makes in a kind of wire sawing apparatus, including X-Y positioning units, passes through measurement orientation with horizontal and vertical position and adjusts crystal. Which ensure that additional rotary freedom is kept on crystal-cut face, realizes that cutting lacks power perpendicular to feed direction and longitudinal direction, do not deflect tool and cutting force minimum. Again improve orientation accuracy.
机译:本发明涉及一种用于确定取向晶面(100)和晶面(2)的装置和方法。该方法允许定向,并且其中消除了粘附缺陷的晶体或污染修复元件的晶体。因此,角度是由被测晶体的平面和基准以及角度,是由晶体面和基准测量以及差值计算得出的。然后需要进行校正的一种线锯设备,包括X-Y定位单元,通过水平和垂直位置的测量方向进行调整,并调整晶体。这确保了在晶体切割面上保持额外的旋转自由度,实现了切割缺乏垂直于进给方向和纵向的动力,不会使刀具偏斜并且切割力最小。再次提高定位精度。

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