首页> 外国专利> Isolation material for layers in intergrated circuits with damascene archtitecture, comprising molecules having atoms at the surface only, like for example fullerenes

Isolation material for layers in intergrated circuits with damascene archtitecture, comprising molecules having atoms at the surface only, like for example fullerenes

机译:具有大马士革结构的集成电路中各层的隔离材料,仅包含在表面仅具有原子的分子,例如富勒烯

摘要

Insulating layer material for integrated circuits in damascene architecture contains or consists of molecules (I), with atoms only on the surface, that are separated from one another by other (groups of) molecules (II) having at least 2 positions bound by chemical and/or physical interactions with (I).
机译:镶嵌结构中用于集成电路的绝缘层材料包含分子(I)或由分子(I)组成,分子仅在表面上,被其他(组)分子(II)彼此隔开,分子(II)的至少两个位置被化学键和/或与(I)的物理相互作用。

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